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Last updated: 08/01/01

3D Museum

by SP-500 Surface Profiler

Please click to enlarge the image.

Metals

Coin-1yen FD-lid-metal

Coin

VSI

 FOV: 3.6mm

Height: 50um

FD Metal Lid

VSI

 FOV:

Height: 1um

Plastics

FD-media  

FD Media Surface

PSI

 FOV:

Height: 1um

      

Semiconductors/Wafers

Wafer-1 Wafer-2

Si Wafer
(Highly polished)
Ra=0.36nm

PSI

 FOV: 80um

Height: 1nm

Si Wafer
(Polished)
Ra=0.65nm

PSI

 FOV: 80um

Height: 2nm
Wafer-3 Wafer Center Surface Profile

Si Wafer
(Little polished)
Ra=1.27nm

PSI

 FOV: 80um

Height: 7nm

Si Wafer
(Center)

PSI

 FOV: 200um

Height: 25nm

Semiconductors/Bumps

Bump-stud Bump-stud imaged by SPIP

Bump(Stud)

VSI

 FOV: 0.8mm

Height: 40um

Bump(Stud)
imaged by "SPIP" software

VSI

 FOV: 0.8mm

Height: 40um
Bump-grid Cu Bump

Bump(Grid)

VSI

 FOV: 0.8mm

Height: 5um

 Bump(Cu)   FOV: .3mm

Height: 100um

Semiconductors/Others

via-hole Probe-mark

Via Hole

VSI

 FOV: 0.2mm

Height: 15um

Probe Mark

VSI

 FOV: 80um

Height: 0.5um
Panel Pattern Panel roughness

Substrate Pattern

VSI

 FOV: 0.2mm

Height: 10um

Roughness

VSI

 FOV: 0.3um

Roughness:<1um

Flat Panel Display

Photo Spacer Photo Spacer imaged by SPIP

Column Spacer

VSI

 FOV: 70um

Height: 4um

 Column Spacer
imaged by "SPIP" software 		VSI FOV: 70um

Height: 4um
PDP Rib PDP: wall pattern

PDP Rib

VSI

FOV: 700um

Height: 100um

PDP Rib
(with fluorescent agent)

VSI

FOV: 700um

Height: 100um

Magnetic Heads

Magnetic-head  

Head ABS Surface

PSI

 FOV: 2.2mm

Height: 20nm

      

Optical Parts

Lens-covex Optical Flat

Lens

PSI

 FOV:

Height: 1um

Optical Flat
Ra=0.4nm

PSI

 FOV: 1.8mm

Height: 1.5nm

Step Height

Step-10um Step-20nm

10um Step Height

VSI

 FOV: 0.8mm

Height: 10um

20nm Step Height

PSI

 FOV: 0.8mm

Height: 20nm

 

Film Thickness NEW

Thickness Step1 Surface ThicknessStep1 Backsurface

Film Step Wafer #1
/Surface

 VSI for Film FOV: 0.19mm

Step Height: 2.9um

 Film Step Wafer #1
/Bottom Surface		 VSI for Film FOV: 0.19mm

Step Height: 0.0um
ThicknessStep1 Thickness  
Film Step Wafer #1
/Thickness		 VSI for Film FOV: 0.19mm

Film Thickness:

4.1um/1.1um

      
Thickness Step2 Surface ThicknessStep2 Backsurface

Film Step Wafer #2
/Surface

 VSI for Film FOV: 0.19mm

Step Height: 3.3um

 Film Step Wafer #2
/Bottom Surface		 VSI for Film FOV: 0.19mm

Step Height: 2.2um
ThicknessStep2 Thickness  
Film Step Wafer #2
/Thickness		 VSI for Film FOV: 0.19mm

Film Thickness:2.1um/1.0um

      
Surface Backsurface

Film Slope Wafer /Surface

 VSI for Film FOV: 22mm Film Slope Wafer /Subsurface VSI for Film

FOV: 22mm
Thickness  
Film Slope Wafer /Thickness VSI for Film FOV: 22mm

Thickness: 0.7-1.4um

      
Water Surface      
Water Surface VSI for Film FOV: 2mm

Thickness: 0-20um

      

Cell Gap

LCD Cell Gap  

LCD Cell Gap

 VSI for Film FOV: 22mm

Cell Gap: 8.0-8.8um

      

pdf file of this page (270KB)

Related products and technology

SP-500 (Surface Profiler)
SP-500B (Wafer Bump Inspection System)
SP-500P (Panel Surface Profiling System)
Technology of Interferometric Surface Profiler (Sorry in Japanese)


For more information:

Toray Engineering Co., Ltd.
Electronics Division
Tel:+81-77-544-1635
Fax:+81-77-544-6091
http://www.scn.tv/user/torayins/

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