Bump Inspection System SP-500B

The SP-500B Bump Inspection System is the latest version of Toray's Automatic Bump Inspection System Series, which has a long history of more than ten years.

The SP-500B automatically measures the heights, coplanarity, shapes and positions of the bumps on wafers or IC chips.

The 3D profiling technique is based on a newly developed optical interferometry, which has the world fastest measurement speed with sub-micron accuracy of height measurement.

A new product, the Wafer-Bump Inspection System SP-500BW was press-released. (Dec. 2003)

Fully automatic bump inspection
Superior repeatability and accuracy with non-contact and non-destructive
Revolutionarily fast scan speed of maximum 100um/sec achieved by a new signal processing algorithm
Full three-dimensional areal surface measurement
Wide measurement range of 0-100um (max. 350 um; optional)
Objective selectable for optimum Field-Of-View
Easy operation with Windows NT in Japanese/English
DSP board for high-speed signal processing (optional)
Automatic wafer loading (optional)

Measurement Technique	Narrow-band White-Light Interferometry
Algorithm	SB Algorithm; jointly invented by Tokyo Institute of Technology and Toray Engineering Co., Ltd.; Patent-Pending
Samples	Wafer (maximum size: 200mm); IC Chips on a tray
Load/Unload	Manual/Auto
Items to be Inspected	(1)Height; Coplanarity (2)Size (Diameter; Area) (3)Position (4)Shape (Roundness, etc)
Repeatability	Dependent on the various parameters; [Example] Sigma(Average)= 20 nm for Standard Step Height
Range of Height Measurement	0 - 100 um (Optional: 0 - 350 um)
Height Resolution	1nm
Vertical Scan Speed	Selectable; Max. 100 um/sec
Focus	Automatic
Horizontal Resolution	Selectable; Max. 512x480 pixels [Optional: 1400x1000 pixels]
Objectives	Selectable; 2.5X, 5X, 10X, 20X, 50X
DSP Board	Optional
Throughput	Dependent on various conditions; as high as 250 bumps/sec
Computer System/OS	PC/Windows NT
Cleaness	Compativble to Class 10-100
Utilities	AC 200V, 1 KVA; Air; Vacuum


IC Bump	IC Bump (3D Display)

Chip Map	Wafer Map

For more information:
Toray Engineering Co., Ltd.
Electronics Division
Tel:(077)544-1635
Fax:(077)544-6091
http://www.scn.tv/corp/torayins/