Last modified: 2008/05/25
Products
Non-Contact
Film Profiler
SP-500F
[Now
unified with SP-700]
|
The SP-500F is the world's first 3-D
areal film profiler based
on vertical scanning white-light interferometry. The SP-500F can measure the front and back surface profiles plus the thickness distribution of a transparent film simultaneously. Its application fields include semi-conductors, data storage, LCD/PDP, plastic films, optics and precise mechanical parts. |
Features
|
Specifications
| Model | SP-500F | ||
| Measurement Technique | Vertical Scanning Interferometry |
||
| Algorithm | Film Surface & Thickness Profiling Algorithm (KF Algorithm) |
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| Range of Measurement | 0 - 100 um (Optional: 0 - 350 um) |
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Applications |
|
||
| Thickness Range | 0.6 - 50 microns |
||
| Objectives | Selectable; 2.5X, 5X, 10X, 20X, 50X |
||
| Measurement Speed | Dependent on the various
parameters; |
||
| Vertical Resolution (Display Unit) |
1 nm |
||
| Measurement Array | Selectable; 512x480, 256x240,
128x120, 64x60 |
||
| Computer System/OS | PC/Windows NT |
||
| Options | Same as the SP-500 |
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| Utilities | AC 90-110V; 50/60 Hz; 1 KVA |
||
Subject to change without notice.
@
Test Results: SiO2 Film on Si
Wafer
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Front Surface Map |
Back Surface Map |
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Thickness Variation |
Thickness Profiles |
For more
information:
Toray Engineering Co., Ltd.
Electronics Division
Tel:(077)544-1635 Fax:(077)544-6091
http://www.scn.tv/user/torayins/
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