Panel Inspection System SP-500P

The SP-500P Panel Surface Profiling System automatically measures various kinds of surface topological features such as height & width of patterns, surface roughness, and depth & diameter of via holes.

The 3D profiling technique is based on a newly developed optical interferometry, which has the world fastest measurement speed with sub-micron accuracy of height measurement.

Fully automatic panel surface measurement
Superior repeatability and accuracy with non-contact and non-destructive
Revolutionarily fast scan speed of maximum 100um/sec achieved by a new signal processing algorithm
Full three-dimensional areal surface measurement
Wide measurement range of 0-100um (max. 350 um; optional)
Objective selectable for optimum Field-Of-View
Easy operation with Windows NT in Japanese/English
Automatic panel loading (optional)

Measurement Technique	Narrow-band White-Light Interferometry
Algorithm	SB Algorithm; jointly invented by Tokyo Institute of Technology and Toray Engineering Co., Ltd.; Patent-Pending
Samples	PCB substrate (maximum size: 500mm x 500mm)
Load/Unload	Manual/Auto
Items to be Inspected	(1)Height & Width of Patterns (2)Depth & Size (Diameter; Area) of Via Holes (3)Surface Roughness
Repeatability	Dependent on the various parameters; [Example] Sigma(Average)= 20 nm for Standard Step Height
Range of Height Measurement	0 - 100 um (Optional: 0 - 350 um)
Height Resolution	1nm
Vertical Scan Speed	Selectable; Max. 100 um/sec
Focus	Automatic
Horizontal Resolution	Selectable; Max. 512x480 pixels [Optional: 1400x1000 pixels]
Objectives	Selectable; 2.5X, 5X, 10X, 20X, 50X
Computer System/OS	PC/Windows NT
Cleaness	Compativble to Class 10-100
Utilities	AC 200V, 1 KVA; Air; Vacuum


Panel Pattern	Via Hole

Surface Roughness

For more information:
Toray Engineering Co., Ltd.
Electronics Division
Tel:(077)544-1635
Fax:(077)544-6091
http://www.scn.tv/user/torayins/