Last modified: 2008/05/25
Products
Non-Contact
Surface Profiler
for Thin-Film Covered Surfaces
SP-700
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The SP-700 is the world's first
surface profiler for thin-film covered surfaces based on vertical scanning white-light
interferometry. The SP-700 can simultaneously measure the front and back surface profiles plus the thickness distribution of a transparent thin-film even when its thickness is under 1 micron. Its application fields include semi-conductors, data storage, LCD/PDP, plastic films, optics and precise mechanical parts. The SP-700 is the latest and highest model of the SP-series products. |
Features
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Specifications
| Model | SP-700 | ||
| Measurement Technique | Vertical Scanning Interferometry |
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| Algorithm | Thin Film Surface & Thickness Profiling Algorithm (NF Algorithm) |
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| Range of Measurement | 0 - 40 um (Optional: 0 - 200 um) |
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Applications |
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| Thickness Range | 0.05 - 30 microns |
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| Objectives | Selectable; 2.5X, 5X, 10X, 20X, 50X |
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| Measurement Speed | Dependent on the various parameters. |
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| Vertical Resolution (Display Unit) |
0.01 nm |
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| Measurement Array | Selectable; 512x480, 256x240,
128x120, 64x60 |
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| Computer System/OS | PC/Windows NT |
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| Options | Same as the SP-500 |
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| Utilities | AC 90-110V; 50/60 Hz; 1 KVA |
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Subject to change without notice.
@
Test Results: CMP Film

For more
information:
Toray Engineering Co., Ltd.
Electronics Division
Tel:(077)544-1635 Fax:(077)544-6091
http://www.scn.tv/user/torayins/
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