Last modified: 2009/03/18

Products

Non-Contact Surface Profiler
SP-500

TORAY SP-500 The SP-500 is the world's fastest 3-D areal surface profiler based on vertical scanning white-light interferometry.

Its application fields include semi-conductors, data storage, LCD/PDP, plastic films, optics and precise mechanical parts.

A paper on the SP-500 development won the 2001 SICE(Society of Instrument and Control Engineers) Technology Award.

Features

  • Superior repeatability and accuracy with non-contact and non-destructive
  • Revolutionarily fast scan speed of maximum 214um/sec achieved by a new signal processing algorithm
  • Full three-dimensional areal surface measurement
  • Wide measurement range of 0-100um
  • Objective selectable for optimum Field-Of-View
  • Easy operation with Windows NT in Japanese/English
  • Flexible to an automated system

Specifications

Model SP-500
(Standard)		 SP-500HR
(High Res)
Measurement Technique

Narrow-band White-light Interferometry (Vertical Scanning Interferometry), and Phase-Shift Interferometry
Algorithm

SB Algorithm; jointly invented by Tokyo Institute of Technology and Toray Engineering Co., Ltd.; Patent-Pending

Range of Measurement

0 - 100 um (Optional: 0 - 350 um)
Vertical Scan Speed

Selectable; Max. 214 um/sec

 Selectable; Max. 60m/sec
Objectives

Selectable; 2.5X, 5X, 10X, 20X, 50X
Measurement Speed

Dependent on the various parameters;
[Example] In case of 25 um range & 128*120 pixel array,

Total : 0.8 sec
Vertical Resolution
(Display Unit)

1 nm with Vertical Scanning Interferometry;
0.01nm with Phase-Shift Interferometry
Measurement Array

Selectable; 512x480, 256x240, 128x120

 Selectable; max. 1376x1040
Computer System/OS

PC/Windows NT
Options

Image Zoom Lens (0.35X, 0.45X, 0.6X, 2X, 4X)
Continuous Zoom Lens
Vibration Isolation Table
Phase-Shift Measurement Software
Film Surface & Thickness Profiling Software
Bump Measurement Software
Magnetic Head Measurement Software
Stitching Software
Offline Software "SPView"
Automatic X-Y Stage
Utilities

AC 90-110V; 50/60 Hz; 1 KVA

Subject to change without notice.

Objective Lens and FOV (without image zoom lens)

　

Standard Camera

High-Res Camera (HR model)

Objevtive　

FOV (mm)

Pixel Size (um)

FOV (mm)

Pixel Size (um)

2.5X

1.6X1.4

3.2

3.5X2.7

2.6

５Ｘ

0.80X0.72

1.6

1.8X1.3

1.3

10X

0.40X0.36

0.8

0.88X0.67

0.67

20X

0.20X0.18

0.4

0.44X0.33

0.33

50X

0.08X0.07

0.16

0.18X0.13

0.13

Dependent on the image zoom lens

Test Results

Step Height

IC Bump

IC Bump (3D Display)

IC Bump (Limited Area; 3D Display)



For more information:
Toray Engineering Co., Ltd.
Electronics Division
Tel:(077)544-1635 Fax:(077)544-6091

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