INSPECTRA in English

The INSPECTRA-1000EX system enables fully automated defect-inspection of IC or thin film magnetic head wafers.

The use of Toray's proprietary defect inspection algorithm, based on the DSI (Die-to-Statistical Image) comparison method, minimizes the generation of false defects and automates conventional visual inspection.

The INSPECTRA-1000EX fully automated inspection system consists of a white-light microscope, a XYZ-theta stage, a cassette-to-cassette wafer handler and an image processing unit, which contains all the machine vision software to perform pattern recognition and defect detection.

Fast
Fully automated handling
Build-in high-speed pattern recognition system
Automatic position & angle correction
Defective die wafer map
Automatic flat finder
High precision auto focus
Operator friendly
Eliminates operator fatigue
Provides consistent data
Reduces inspection cost

Sample .................................... IC or Thin film Magnetic Head Wafers
Wafer size .............................. 4" ~8" (200mm optional)
Wafer Thickness .................... Max. 4.0mm
Cassette ................................. 2 unit
Wafer Transfer ....................... Automatic [by a robot]
Objective Lens ....................... 1.25x, 2.5x, 5x, 10x (20x, 50x optional)
Defect Detection ..................... DSI Algorithm
Alignment ............................... Automatic (pattern recognition)
Throughput ........................... 0.035 sec/FOV
................................................28 sec/ wafer typical (6" full wafer)
................................................37 sec/ wafer typical (8" full wafer)
................................................62 sec/ wafer typical (200mm full wafer)
................................................including Wafer Exchage Time 15sec.
Utilities ................................... 100VAC, 20A, 50/60Hz; Air; Vacuum
Dimensions ............................. 2170mm(W) x 1040mm(D) x 1820mm(H)